Kingmax Mars DDR2-1066 Memories

Known for their overclocking performance, Kingmax memory products havequietly transitioned into the DDR2 era. Since the days of PC-100/133, Kingmaxwas the world’s first to launch proprietary TinyBGA-packaged PC-150 memorymodules and the only brand to offer lifetime warranty for its products, quicklymaking it one of the top three memory brands in Taiwan. Today, as DDR2 is nowthe reigning standard, all memory products are completely BGA packaged – atechnology Kingmax has been building up for the past eight years. Kingmax hasalso invested US$ 10 million to purchase the T5593 testing system, once againunderscoring Kingmax’s DDR2 strengths. Without any entry barriers, Kingmax hassuccessfully and smoothly launched three JEDEC memory modules, i.e. DDR2-533,-667 and -800. All three memory modules have been introduced in quick successiondue to tight scheduling for new products using DDR2 modules. Expecting aless-than-massive demand – compared to the DDR era – in the overclocking market,we have adopted a steadfast business approach, supplying consumers with memoryproducts of the best quality. 100% compatibility and performance make them thebest choice for your personal and notebook computer.

A brief glance at trends in product development shows that Northbridge chipsets,including Intel 945/955 and 965/975 and NVIDIA nForce 680i/650i, can alldirectly support 1066MHz; and Intel has also launched a stream of CPUs,including dual-core X6800, E6700 and E6600 and quad-core QX6700 and QX6600,enabling 1066MHz FSB support. In fact, the latest CPUs, codenamed E6850, E6750and E6650, already have FSB supporting 1333MHz. In the foreseeable future, DDR2memory modules will be starting off at the frequency of 1066MHz. Foroverclockers pursuing extreme performance, this is undoubtedly an exciting pieceof news.

Given the outlook, Kingmax is ready with DDR2-1066 512MB/1GB Mars series memorymodules to leverage these computing advances. Utilizing Nanya chips, which areinherently high quality and comparable with Micron D9 chips, and backed witheight years of experience in BGA packaging, each of Kingmax DDR2-1066 512MB/1GBMars series memory modules is shipped at close to 10% overclocking headroom,meeting overclockers’ extreme speed demands.

Kingmax is the world’s first memory module maker with its own advanced packagingand testing equipment, completing a vertically integrated supply chain. Everystep after purchase – from chip cutting, testing, packaging to finished producttesting – is independently completed at Kingmax’s own packaging plant. Sevenyears earlier, Kingmax developed the BGA packaging technology and successfullyapplied it en masse in SDRAM and DDR products. In fact, its TinyBGA packagingtechnology – a proprietary patented technology in the memory field, is highlyacclaimed in the industry. Kingmax is thus fully prepared to face up to thedemanding challenge of BGA packaging, whether in terms of technical readiness,upgraded facilities or personnel training.

Kingmax consistently focuses on developing lead-free manufacturing processes.Not only does it use lead-free IC chips in its high-quality DDRII eco-friendlylead-free memory modules but has also adjusted parameters, such as temperature,and welding material used in PCB and SMT production line. In addition, Kingmaxlead-free memory modules have passed high-temperature reliability testing,completely meeting RoHS standards, and meet environmental requirements in theUnited States, Japan and China while ensuring product performance. For Kingmax,a lead-free manufacturing capability adds strength to the development of itscompetitiveness in the future.

KINGMAX Mars DDR2-1066 Long-DIMM memory product features:
- 240-pin DDR2 1066MHz
- CAS Latency: 5-5-5-15
- Memory bandwidth: 8.5GB/sec (dual-channel 17GB/sec)
- Voltage: 1.8V, saving approximately 50% power, consumption: excellent heatdispersion
- Capacity: 512MB/1GB
- Worldwide free lifetime warranty